LtF Process for Fan-Out Packaging Process
Introducing dry film stripping agents and seed layer (copper/titanium) etching solutions!
The "LtF Process" is a product for the Fan-Out packaging process. We offer amine-based dry film resist stripping solutions, copper sputter seed layer etching solutions, and titanium sputter seed layer etching solutions. 【Features】 ■ Dry film stripping agent ⇒ Reduces copper dissolution ■ Copper sputter seed layer etching solution ⇒ Maintains stable performance due to continuous supply method ■ Titanium sputter seed layer etching solution ⇒ Low corrosiveness to other metal materials and excellent selective etching properties *For more details, please refer to the PDF document or feel free to contact us.
- Company：メルテックス
- Price：Other
